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Exam Code: IL0-786 Designing Flexible Wireless LAN Solutions information hunger January 2024 by Killexams.com team
Designing Flexible Wireless LAN Solutions
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IL0-786 Designing Flexible Wireless LAN Solutions

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Designing Flexible Wireless LAN Solutions
Question: 65
A customer has a DHCP server on the network and wants the Intel PRO/Wireless Access
Point to be automatically assigned an P address from this server. What must you do to
allow this capability on a new installation?
A. You use the serial interface and enable DHCP.
B. You first assign a static IP and then reboot the Access Point to enable DHCP.
C. No configuration is required. DHCP is the default configuration.
D. There is nothing you can do. DHCP is not supported on the Access Point.
Answer: C
Question: 66
Which three attenuate RF signals the most? (Choose three.)
A. metal
B. plaster
C. concrete
D. paper rolls
Answer: A,C,D
Question: 67
What is WEP?
A. Wired Equivalent Privacy
B. Windows Equivalent Privacy
C. Wireless Equivalent Privacy
D. Windows Equivalent Protection
Answer: A
Question: 68
Wireless infrastructure networking requires which two parameters? (Choose two.)
B. hop sequence
C. encryption level
D. access control list
Answer: A,C
Question: 69
What is the first level of security encountered when managing an AP?
B. 40-bit encryption
C. 128-hit encryption
D. system password
Answer: D
Question: 70
What are two methods of loading an ACL on an AP? (Choose two.)
A. load an ACL from a file using Xmodem
B. Telnet to the AP, then load an ACL file
C. manually enter individual MAC addresses
D. manually enter a range of MAC addresses
Answer: C,D
Question: 71
MobileUnit 2 are out of range of each other.MobileUnit 1 and MobileUnit 2 transmit at the
same time and a collision occurs.What is this issue called?
A. multipath
B. skin effect
C. hidden node problem
D. Differentiated Inter-Frequency Stability
Answer: C
Question: 72
What do the periods in front of certain configuration options indicate?
A. The option can be saved to all APs with the same subnet.
B. The option can be saved to all APs with the same ESSID.
C. The option can be saved to all APs on the same subnet and same firmware revision.
D. The option can be saved to all APs with the same ESSID and same firmware revision.
Answer: D
Question: 73
What are two ways to deny access to a network through an AP? (Choose two.)
Answer: A,C
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Intel Designing information hunger - BingNews https://killexams.com/pass4sure/exam-detail/IL0-786 Search results Intel Designing information hunger - BingNews https://killexams.com/pass4sure/exam-detail/IL0-786 https://killexams.com/exam_list/Intel Intel Bets On ‘Transistor-Resilient Design’ To Avoid Past Mistakes

The semiconductor giant wants to avoid past mistakes that have resulted in product delays by taking a new approach to the way it designs chips, which has already resulted with what the company says is the ‘largest single intranode enhancement in its history’ that will significantly increase performance for Intel’s upcoming Tiger Lake processors. ‘The era of getting massive performance boost from simply shrinking transistor features is behind us,’ one architect says.


Intel is embracing a new “transistor-resilient design” approach so that it can continue to push the envelope for its products without getting held back by manufacturing issues.

This new approach was detailed during the Intel Architecture Day pre-briefing event Tuesday with several major new technology and product disclosures —less than three weeks after the Santa Clara, Calif.-based company revealed that a defect in the company’s manufacturing process would delay the delivery of its next-generation 7-nanometer products by six months.

[Related: Partners: Intel Still Strong Despite 7nm Delays, AMD Gains]

Raja Koduri, the former AMD chief architect who was hired away by Intel in 2017 to drive new silicon architectures, started the event by acknowledging that Intel’s traditional approach of designing processors has been so tightly paired with the company’s ability to manufacture chips with higher transistor densities that it has resulted in delays of multiple products, including 10nm processors.

“Our design methodology has historically been tightly coupled to a single transistor target. This makes it very hard to move our new architectures, new features and new IP quickly to different process technologies, either external or internal,” said Koduri, Intel’s chief architect who leads the Architecture, Graphics and Software Group. “Our customers rely on our execution. A ‘transistor-resilient design’ would have allowed us to deliver PCIe Gen 4 or a Sunny Cove CPU or an Xe GPU to the market sooner during the time when we had challenges with our 10nm process transition.”

This new approach is evident in the company’s forthcoming 10nm Tiger Lake mobile processors for laptops, which are expected to launch in September.

While Intel has previously made smaller, incremental improvements within its six-year-old 14nm node—in part to make up for subsequent 10nm delays—the company said it devised a way to deliver what it has called the “largest single intranode enhancement in its history,” which is comparable to a full node transition, like when the company moved from 14nm to 10nm.

The company is using this historical intranode improvement for the Willow Cove cores that are going into Intel’s new Tiger Lake processors, which the company said is allowing it to deliver a “more than generational performance leap” over its first 10nm processors for volume production, Ice Lake.

“We were able to deliver a greater than generational improvement performance by not only dramatically lowering the voltage at which Willow Cove achieves its operating frequencies versus Sunny Cove, but we were also able to extend the range,” said Boyd S. Phelps, vice president of the Client Engineering Group and general manager of the Client and Core Development Group.

This major intranode boost was made possible by a new technology Intel calls 10nm SuperFin, which is a reference to how the technology redefines its 3D FinFET transistor technology and combines it with a new super metal-insulator-metal capacitor to drive performance and efficiency in a variety of ways.

“The era of getting massive performance boost from simply shrinking transistor features is behind us,” said Ruth Brain, an Intel Fellow and director of interconnect technology and integration.

Intel is also using its 10nm SuperFin technology for its DG1 and SG1 discrete GPUs, which the company plans to start shipping later this year for laptops and servers, respectively.

The company is already working on an enhanced version of 10nm SuperFin, which will provide additional performance, new interconnect innovations and optimizations for data center applications.

Intel’s newly disclosed Xe-HP discrete GPU for high-performance data centers will use the enhanced 10nm SuperFin while the previously announced Ponte Vecchio discrete GPU will rely on 10nm SuperFin and enhanced 10nm SuperFin for its base tile and Rambo Cache tile, respectively.

This new approach to intranode improvements means Intel is ditching the plus sign that has been used to name previous intranode enhancements, like 14nm+++.

“They were so many pluses that we often internally mixed up the actual plus count,” Koduri said. “Left unchecked, we were going down the same path in our intranode improvement in 10nm. The number of repetitive calls or emails I sent to my designers, querying about how many pluses were on one chip versus another, was getting ridiculous.”

Intel is looking to push the design envelope in other ways, including how it packages different silicon functions and IPs together on a system-on-chip. The company has already been heading down this path with its Embedded Multi-die Interconnect Bridge and Foveros 3D packaging technologies—the latter of which is used for Intel’s new Lakefield hybrid processors—but it’s already looking at how it can slice and dice the various elements of its processors into more specialized chips.

With a new design methodology Intel is calling “Client 2.0,” the company said it is creating the groundwork to build purpose-built client processors that use tiny silicon functions and IPs as building blocks so that it can significantly reduce the development time to one year from the three to four years it typically takes for monolithic chips and the two to three years for multi-die chips.

While Intel didn’t share any plans for when it will release new products using the new approach, the company said it represents a long-term vision.

“Overall, Client 2.0 is about delivering winning products at an annual cadence,” said Brijesh Tripathi, vice president and chief technology officer for Intel’s Client Computing Group.

By mixing and matching different building blocks—for things like graphics, compute, I/O and artificial intelligence—these chips can suit different user types, like gamers and commercial users.

“For example, a corporate employee could be using a lot of productivity tools and want a lot of AI capabilities. A gamer might want a large graphics and AI engine while a content creator might want to have a lot of graphics and compute,” Tripathi said.

While the company is taking advantage of a number of new design methodologies to bring performance and efficiency to the next level, the company is also turning to third-party chip foundries for new products—which CEO Bob Swan said may happen more in the future if manufacturing issues persist.

This reliance on foundries was evident in the company’s discrete GPU plans. While Ponte Vecchio, for example, will use Intel’s new 10nm SuperFin processes, it will rely on external processes for the GPU’s Xe Link tile and for some of the product’s compute tile, which Koduri said was planned from the beginning to provide Intel more flexibility. The company’s newly disclosed Xe-HPG GPU for desktop PCs, on the other hand, will entirely rely on a foundry for manufacturing.

“This helps with our execution immensely,” he said.

Thu, 13 Aug 2020 01:00:00 -0500 text/html https://www.crn.com/news/components-peripherals/intel-bets-on-transistor-resilient-design-to-avoid-past-mistakes
AI Helps Chipmakers Design the Very Processors That Speed Up AI

You probably know that Apple, Nvidia, Qualcomm, Samsung and just about anybody else who makes processors is stuffing their products with circuitry to accelerate AI tasks. What you might not know is that AI is also being used to accelerate the design of those very processors.

Case in point: Intel. The Santa Clara, California-based company plans to detail its new Meteor Lake processors on Thursday, products it hopes will transform laptops into what it calls "AI PCs." But Intel also used AI to create those processors.

AI tools catch bugs early in the design process so chips come to market faster, and they oversee manufacturing so more of the tiny slices of silicon that Intel makes end up inside products instead of in the trash can. For Meteor Lake, Intel's first major processor made of multiple "chiplets" stacked into one package, the AI tools help find the best way to sell each processor given a multitude of slight differences in each processor's components.  

With these AI tools, "the amount of sellable units is increasing significantly," Shlomit Weiss, a co-leader of Intel's Design Engineering Group, said in an exclusive interview.

See also: Inside Intel's Chip Factory, I Saw the Future. It's Plain Old Glass

That's key for Intel, a company scrambling to reclaim chipmaking leadership lost to Taiwan Semiconductor Manufacturing Co. (TSMC) and rebuild the US industrial base. And if you're one of the millions of people who uses a Windows PC, it's important for you too, since better manufacturing means laptops that perform better and cost less.

Processors these days consist of tens of billions of tiny electronic on-off switches called transistors. Information in the form of ones and zeros cascades through them to spell-check your resume, calculate your income tax and sharpen that picture on your phone. Figuring out how to optimally arrange all those transistors and to check that they'll perform as needed is beyond any human, so computers have long been essential to the processor manufacturing business.

But using AI is a new wrinkle. Artificial intelligence systems, trained to recognize patterns in complex real-world data, can perform tasks like screening out spam and identifying your face in your phone's camera roll. Now they're helping humans to get a better handle on processor production. 

An Intel engineer holds a Meteor Lake processor at an Arizona fab where Intel develops packaging technology for the products.

Stephen Shankland/CNET

"As Moore's Law progresses and we get more and more transistors, you can't hand-tune everything anymore," said Real World Insights analyst David Kanter.

Intel isn't alone. Cadence and Synopsys, two major makers of the software tools used to design processors, offer AI-boosted tools to lay out processor elements. Google has described how it used AI to develop its AI acceleration processors. And Nvidia, the top AI and graphics chip designer, has used AI extensively to replace much slower traditional computing processes in creating its products.

One type of AI used in the technology is called reinforcement learning. In it, an AI system explores a range of options and is rewarded when it finds outcomes that come closer to a desired goal. "That reinforcement learning can potentially take the human out of that loop," said Elyse Rosenbaum, a professor of engineering at the University of Illinois.

Intel is combining AI tools from outside chip design companies with its own internally developed tools, said Weiss and her co-leader, Navid Shahriari. Some examples of the internal tools:

  • While simulating new designs, Intel AI analyzes bug reports and categorizes the bugs, work that lets human engineers get to work sooner on fixing the problems. "It can save a few hours for several people per day," Weiss said.
  • Intel has begun testing generative AI tools that process the detailed written specifications for a chip to create tests that actually ensure chip designs meet those specs. People do that work today, but they can make mistakes, Weiss said. Intel is using OpenAI's GPT, a large language model that's been modified for Intel's particular needs, running internally on Intel's own systems.
  • Intel uses AI to scrutinize chips coming off the manufacturing line, each of which has slightly different characteristics like clock speed, cache memory size and power consumption. The AI system can look at this complex collection of interrelated details and find the best way to fit processors into one of the various versions Intel will sell, Shahriari said.

Finding the best way to sell a chip is more complicated with Meteor Lake since it's got multiple interlinked chiplets, also called die, which means many more combinations of all those characteristics to analyze.

But the AI system can find the right balance, meaning a higher yield -- the fraction of chips that are usable.

"You can find that sweet spot of the multiple die that's on that one Meteor Lake device," Shahriari said. "It not only maximizes the yield but also gives you performance and power improvement."

I Got an Early Look at Intel's Glass Packaging Tech for Faster Chips

See all photos
Tue, 12 Dec 2023 23:00:00 -0600 en text/html https://www.cnet.com/tech/computing/ai-helps-chipmakers-design-the-very-processors-that-speed-up-ai/
Intel has hired former HPE executive Justin Hotard to run its Data Center and AI group

Chipmaking giant Intel Corp. announced today it has hired former Hewlett-Packard Enterprise Co. executive Justin Hotard as the new executive vice president and general manager of its key Data Center and AI Group. The new exec, who is regarded as a specialist in artificial intelligence and high-performance computing, will be tasked with boosting Intel’s market share in the growing AI hardware industry.

Hotard (pictured) replaces Sandra Rivera, who stepped back from leading the Data Center and AI unit to assume the role of chief executive at Intel’s new Programmable Solutions Group. The company announced in October it was spinning off that unit into an independent business, in preparation for an initial public offering that’s slated to come in two-to-three years.

It’s a key hire for Intel, which faces challenges in almost every area of the chipmaking industry. But none are seen as more important than the AI chip segment, where rival Nvidia Corp. has emerged as the most dominant player with its graphics processing units that power generative AI systems such as ChatGPT.

The company also faces increased competition from Advanced Micro Devices Inc., which has become stronger than ever thanks to the capabilities of its EPYC processors that are used in data center servers. In addition, there are plenty of new players in the industry, offering Arm-based chops for cloud servers. Added to that, some of Intel’s biggest customers, such as Google LLC and Amazon Web Services Inc., are also designing their very own central processing units for data center workloads.

As competition in the chipmaking industry heats up, Intel itself has become much more diversified, expanding into different areas. For instance, its Xeon CPUs are designed to handle far more workloads than before, while it also offers its own GPUs for AI and HPC applications, as well as its Gaudi AI accelerators.

As the leader of Intel’s Data Center and AI Group, Hotard will be asked to boost the company’s prominence in the red-hot AI industry in order to capture a bigger share. It’s a vital market for Intel, as many analysts believe it will expand significantly in the coming years, and perhaps become the most important segment of the semiconductor industry.

Intel Chief Executive Pat Gelsinger said Hotard is a “proven leader” and boasts an impressive track record in driving growth and innovation in the data center and AI industries. “Justin is committed to our vision to create world-changing technologies,” the CEO said. He added that he’s also “passionate about the critical role Intel will play in empowering our customers for decades to come.”

Hotard most recently held the position of executive vice president and general manager of HPE’s AI and HPC business unit. In addition, he led that company’s AI research efforts in his role as the head of Hewlett Packard Labs. Prior to joining HPE, he served as the president of NCR VOYIX Corp. He has also served at companies including Motorola Mobility LLC and Symbol Technologies Inc.

The decision to hire an outsider to take over the running of such a vital business unit comes as a surprise, and some might say it calls into question the company’s confidence in its existing executive bench. That said, Hotard has performed well in his role at HPE, helping to grow its AI and HPC business unit’s revenue to $1.18 billion in the quarter ending Oct. 31, up from $862 million a year earlier. In an interview with SiliconANGLE’s mobile livestreaming studio theCUBE in November, he emphasized his belief in the importance of on-premises AI workloads, as opposed to AI powered by cloud servers.

A report from CRN suggests that Intel’s ability to snatch Hotard away from HPE is a “huge coup” for the company, at a time when big tech firms are engaged in an increasingly fierce battle to snap up the hottest AI talents.

C.R. Howdyshell, CEO of Advizex Technologies, told CRN that companies are now engaged in a “talent war”, competing with one another to hire the limited number of executives and technologists with experience of AI. “It’s a challenge to get AI talent, which is why you are also going to see acquisitions of AI companies,” he said.

Photo: SiliconANGLE

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Thu, 04 Jan 2024 11:46:00 -0600 en-US text/html https://siliconangle.com/2024/01/04/intel-hired-former-hpe-executive-justin-hotard-run-ai-data-center-group/
Intel: Cheap Considering Politics And Progress
Gamers Take Part In the Epic.Lan 38 Esports Tournament

Leon Neal


For the past few years, I have been covering Intel (NASDAQ:INTC), and I have consistently given a buy rating on the company. My arguments throughout these times focused on geopolitical progression [source,

Wed, 06 Dec 2023 22:08:00 -0600 en text/html https://seekingalpha.com/article/4656532-intel-cheap-considering-politics-and-progress
Intel Acquires NetSpeed To Accelerate Specialized Chip Design

Intel has acquired a startup founded by a former employee that will help the company accelerate design of specialized chips for the Internet of Things and other applications.

The Santa Clara, Calif.-based company announced its acquisition of NetSpeed Systems Monday and said the startup's team will join Intel's Silicon Engineering Group, which is led by Jim Keller, an AMD chip design veteran and former Tesla executive who joined the company earlier this year. Terms of the deal were not disclosed.

NetSpeed is the third acquisition made by Intel this year. The company said in August that it had acquired artificial intelligence startup Vertex.Ai to boost its deep learning software tools. The month before, Intel revealed its plan to acquire eASIC Corp., a developer of specialty chips for low-power, high-performance computing.

[Related: Source: Intel 14nm CPU Shortage Tied To 10nm Delay]

Founded in 2011 by former Intel engineer Sundari Mitra, NetSpeed provides interconnect fabric technology and design tools for the system-on-a-chip, a kind of integrated circuit also known as SoC that brings together all the components of a computer, including processor, memory and storage, onto a single chip. According to NetSpeed's website, applications of its technology include automotive, cloud computing, IoT, mobile, networking and storage.

Intel said it will use NetSpeed's tools to accelerate and Strengthen the cost efficiency of SoC design, development and testing. This, the company added, will help "architects estimate and optimize SoC performance in advance of manufacturing through a system-level approach, user-driven automation and state-of-the-art algorithms."

As part of the deal, Mitra will serve as an Intel vice president and report to Keller.

“Intel is designing more products with more specialized features than ever before, which is incredibly exciting for Intel architects and for our customers," Keller said in a statement. "The challenge is synthesizing a broader set of IP blocks for optimal performance while reining in design time and cost. NetSpeed’s proven network-on-chip technology addresses this challenge, and we’re excited to now have their IP and expertise in-house."

The company said that while it will honor NetSpeed's existing customers, it will become an internal asset once their contracts have finished. Before acquiring the company, Intel was a customer and investor, having led NetSpeed's $10 million Series C round in 2016.

Mon, 10 Sep 2018 08:19:00 -0500 text/html https://www.crn.com/news/components-peripherals/intel-acquires-netspeed-to-accelerate-specialized-chip-design
Food, farming, and hunger

Of the 5.9 million children who die each year, poor nutrition plays a role in at least half these deaths. That’s wrong. Hunger isn’t about too many people and too little food. It’s about power, and its roots lie in inequalities in access to resources and opportunities.

Mon, 30 Dec 2013 06:21:00 -0600 en-US text/html https://www.oxfamamerica.org/explore/stories/food-farming-and-hunger/
Intel (INTC) Stock Declines While Market Improves: Some Information for Investors No result found, try new keyword!In the latest trading session, Intel (INTC) closed at $44.04, marking a -1.12% move from the previous day. This move lagged the S&P 500's daily gain of 0.46%. Meanwhile, the Dow experienced a rise ... Mon, 11 Dec 2023 10:00:00 -0600 en-us text/html https://www.msn.com/ Graphic Design Area Graphic Design Area

The Graphic Design program prepares you to become a visual communicator, critical thinker, and creative problem solver. Through our mentorship and curricula, you will learn the history and theory, acquire conceptual, analytical, and practical skills through hands-on exploration, and develop professional portfolios. 

Common careers for graduates include the following in design, advertising, corporate communications, education, publishing, or non-profit sectors:  

  • Visual, production, and interactive design 
  • Art direction 
  • Editorial/publication design 
  • User experience and interface design 
  • Data visualization and Infographics 
  • Branding and packaging design 
  • Experiential graphic design 
  • Motion graphics and title design 

Graphic Design Internship

Internships are one of the best ways to gain hands-on skills while learning real-world applications and techniques in the graphic design industry. Interact with many creative minds, problem-solve and learn new processes, network, and gain opportunities to hone your critical thinking. Register for ART 4850 Internship in Visual Arts and complete your graphic design internship in local or city design agencies and businesses. Once you locate your internship, contact the Graphic Design advisor!

Where can I find internships? You can find internships in the following links below, or you can phone businesses, agencies, non-profit organizations, or design departments:

Need more help? Check out this Guide to Internship by the AIGA.

AIGA Atlanta Student Board Chapter

The American Institute of Graphic Arts (AIGA) Atlanta chapter, the 9th largest chapter of the AIGA, is a professional association for graphic designers in the United States. They guide the Atlanta Student board, a dynamic group that shares its passion for design and learning with the community. Joining the Student board is a great way to find internships and jobs, access design workshops, make connections with your design community, and gain mentorship from design professionals.

BFA Graphic Design Society

The BFA Graphic Design Society is diverse community of design thinkers and creatives. Their goal is to educate and provide resources to current students and encourage them to take preliminary steps in starting their graphic design careers. Members will get a chance to learn about design trends, gain information about internship and possible design career opportunities, connect and engage in design conversation.

Establishing Connection...

Thu, 07 Apr 2022 08:04:00 -0500 en text/html https://ung.edu/visual-arts/visual-art-areas/graphic-design-area.php
Intel Corp.

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